- In May 2024, NanoSilicon Corp., a leading silicon wafer reclaim service provider, unveiled its next-generation reclaim process capable of achieving ultra-low particle counts on 300 mm wafers. This innovation aims to meet the increasing quality demands of advanced semiconductor manufacturing while enhancing reclaim efficiency and reducing processing time.
- In March 2024, RS Technologies Co., Ltd. announced the expansion of its reclaim facility in Taiwan, driven by increased demand from foundries and integrated device manufacturers (IDMs) in the Asia-Pacific region. The new line focuses on reclaiming 200 mm and 300 mm wafers with advanced chemical cleaning and polishing technologies.
- In January 2024, Pure Wafer, a U.S.-based silicon wafer reclaim company, entered a strategic alliance with a leading solar panel manufacturer to provide reclaimed wafers for non-critical solar applications. The move supports cost reduction and circular economy efforts in the solar industry.
- In November 2023, Shinryo Corporation launched a smart wafer traceability system for its reclaim services, utilizing RFID and blockchain technology to track wafer lifecycle and ensure process transparency for clients in the semiconductor sector.
- In August 2023, GlobalWafers Co., Ltd. invested in AI-driven defect detection systems at its reclaim plants in South Korea and Japan, enhancing inspection accuracy and optimizing wafer recovery rates. This aligns with the company’s push toward digital transformation in wafer services.
