- In February 2025, Siemens Digital Industries Software unveiled a certified automated workflow for TSMC’s Integrated Fan-Out (InFO) packaging technology, marking a significant advancement in semiconductor design and manufacturing. The workflow leverages Siemens’ Innovator3D IC, Xpedition Package Designer, HyperLynx DRC, and Calibre nmDRC software to support both InFO_oS and InFO_PoP variants. These tools enable high-density integration, precise design rule checking, and streamlined production, meeting the rising demand for compact, high-performance electronic devices across AI, HPC, and mobile applications
- In January 2024, INEOS Styrolution introduced Zylar® EX350, a new grade of methyl methacrylate butadiene styrene (MBS) material tailored for carrier tapes in electronic component packaging. Engineered for extrusion, Zylar EX350 offers a balanced combination of stiffness and toughness, enabling deeper and more rigid pocket designs compared to traditional GPPS/SBC blends. This enhances component stability, reduces mis-picks during assembly, and improves camera inspection transparency. The launch reflects growing demand for versatile, high-performance, and sustainable packaging materials in the electronics industry
- In December 2023, PwC US acquired nearly all assets of Surfaceink, a California-based product design and engineering firm renowned for its work in consumer electronics and Internet of Things (IoT) projects. This strategic move strengthens PwC’s ability to deliver end-to-end product development, combining Surfaceink’s expertise in hardware design, acoustics, and prototyping with PwC’s consulting and digital transformation services. The acquisition supports PwC’s broader goal of helping clients reinvent business models through human-led, tech-powered solutions, including packaging design, supply chain optimization, and connected product innovation
- In November 2023, the U.S. government introduced a strategic initiative under the CHIPS for America Program to strengthen the nation’s capabilities in advanced semiconductor packaging. The plan includes up to USD 1.6 billion in funding to support the development of a secure, resilient, and high-volume domestic packaging industry. This effort is part of the broader National Advanced Packaging Manufacturing Program (NAPMP), which aims to ensure that advanced-node chips manufactured in the U.S. are also packaged domestically, reducing reliance on overseas facilities and enhancing supply chain security
- In September 2023, Sandvik Coromant advanced its smart packaging capabilities by launching a new AI-driven tool aimed at improving packaging efficiency for industrial cutting tools. This innovation is part of Sandvik’s broader digital transformation strategy, which integrates AI and machine learning to streamline manufacturing workflows and reduce operational complexity. The tool supports automated decision-making, enhances tool selection accuracy, and simplifies data flow across production stages. By embedding intelligence into packaging processes, Sandvik is helping manufacturers reduce waste, boost productivity, and meet growing demands for sustainable and connected solutions in the North American market
