Latest Developments in North America Wi Fi Chipset Market

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Latest Developments in North America Wi Fi Chipset Market

  • Semiconductors and Electronics
  • Oct 2021
  • North America
  • 350 Pages
  • No of Tables: 220
  • No of Figures: 60

  • In 2025, Qualcomm launched its latest FastConnect 7900 platform in the U.S., integrating Wi-Fi 7 and Bluetooth 5.4 technologies. The chipset is optimized for next-gen smartphones and XR devices, offering ultra-low latency and reduced power consumption.
  • In 2025, Broadcom introduced tri-band Wi-Fi 7 solutions for home gateways and mesh systems, targeting ISPs in North America to improve in-home connectivity performance for high-bandwidth applications like 8K streaming and cloud gaming.
  • In 2024, Intel began mass production of BE200 Wi-Fi 7 chipsets, incorporated into high-end laptops and desktops by major OEMs like Dell and HP across North America.
  • In 2024, MediaTek partnered with TP-Link and Netgear to integrate its Wi-Fi 6E chipset platform into North American consumer routers, enabling better connectivity in multi-device households.
  • In 2023, Marvell Technology expanded its Wi-Fi 6E chipset portfolio to serve enterprise networking and automotive infotainment systems, responding to growing demand in commercial and industrial applications in the U.S.
  • In 2022, Qualcomm collaborated with Meta (formerly Facebook) to enhance AR/VR wireless performance using advanced Wi-Fi 6E chipsets in Oculus headsets, marking a strategic push       toward immersive wireless experiences.