- In June 2024, ASML and Imec established a joint high-NA EUV Lithography Lab, creating an early development platform for the advanced semiconductor ecosystem. This collaboration marks a pivotal step toward making high-NA EUV lithography ready for large-scale manufacturing
- In March 2022, Intel announced the start of high-volume production using EUV lithography machines at its new USD 18.5 billion facility in Ireland. This milestone highlights Intel’s ability to manufacture advanced semiconductors at scale with EUV technology, a critical step in regaining its competitive position against rivals such as TSMC and Samsung
- In January 2022, ASML and Intel Corporation entered a new phase of their longstanding partnership to advance semiconductor lithography technology. This collaboration focuses on enhancing state-of-the-art lithography systems, accelerating the development of increasingly complex and efficient microchips
- In October 2021, Samsung Electronics began mass production of 14-nanometer DRAM chips utilizing EUV lithography technology. This breakthrough enables finer circuit designs compared to traditional ArF laser lithography, solidifying Samsung’s leadership in advanced memory solutions for modern electronic devices
- In March 2021, Samsung Electronics intensified efforts to produce EUV scanners, aiming to strengthen its competitive position against TSMC. These advanced scanners streamline chip fabrication by reducing photolithography steps, reflecting Samsung’s commitment to next-generation semiconductor technologies
