- Wafer polishing and grinding equipment is used to smooth, thin, and prepare semiconductor wafers for subsequent processing steps, such as lithography, etching, and packaging. These tools are essential for achieving the necessary wafer planarity, surface quality, and dimensional accuracy in advanced chip manufacturing
- The growing need for ultra-thin wafers in applications such as 5G, AI, and advanced computing, along with increased investments in new fabs and the expansion of 3D NAND and logic chip production, are key drivers fueling the demand for wafer polishing and grinding systems across global semiconductor ecosystems
- Asia-Pacific dominated the semiconductor wafer polishing and grinding equipment market with a share of 69.2% in 2024, due to the concentration of major foundries and memory manufacturers in the region
- North America is expected to be the fastest growing region in the semiconductor wafer polishing and grinding equipment market during the forecast period due to government-backed initiatives and large-scale private investments to boost domestic chip manufacturing
- Deposition segment dominated the market with a market share of 35.1% in 2024, due to its critical role in forming thin films and layers during integrated circuit fabrication. Deposition equipment is indispensable for achieving precise material layering required in advanced node technologies, which has led to its broad adoption among chipmakers focusing on performance enhancement and miniaturization. The high usage of deposition tools in both logic and memory applications further reinforces its dominance, particularly as demand for 3D structures and high-density packaging continues to rise
