- In December 2024, Tokyo Electron Limited (TEL) launched the Ulucus LX, a cutting-edge system utilizing Extreme Laser Lift Off (ELLO) technology for 300mm wafer-bonded devices. This innovation responds to the rising demand for enhanced semiconductor performance and energy efficiency through 3D integration using permanent wafer bonding. The Ulucus LX consolidates laser beam irradiation, wafer separation, and cleaning into a single platform, leveraging TEL’s proprietary expertise in laser control, wafer separation, and cleaning processes. By replacing multiple conventional steps such as back grinding, polishing, and chemical etching, the system significantly boosts productivity while also reducing environmental impact, marking a pivotal advancement in next-generation semiconductor manufacturing
- In June 2022, Applied Materials announced the acquisition of Picosun Oy, a Finnish semiconductor equipment company. This strategic move aims to enhance Applied Materials' ICAPS (IoT, Communications, Automotive, Power, and Sensors) product offerings and deepen customer engagements by integrating Picosun's advanced atomic layer deposition (ALD) technology into its portfolio
- In February 2022, Revasum secured a growth capital facility from SQN Venture Partners, LLC, valued at up to USD 8 million. This debt financing is intended to accelerate the development of new products and provide working capital to support the company's rapid growth, allowing Revasum to expand its capabilities and market reach
