Global Through Hole Mounting Electronics Packaging Market Size, Share, and Trends Analysis Report – Industry Overview and Forecast to 2032

Through Hole Mounting Electronics Packaging Market Size

• The global through hole mounting electronics packaging market size was valued at USD 39.83 billion in 2024 and is expected to reach USD 132.40 billion by 2032, at a CAGR of 16.20% during the forecast period
• The market growth is primarily driven by the increasing demand for reliable and robust electronic components in industries such as aerospace, defense, automotive, and telecommunications, where through-hole technology ensures secure mechanical and electrical connections
• In addition, the resurgence of through-hole mounting in specific applications, coupled with advancements in manufacturing processes and material technologies, is boosting market expansion

Through Hole Mounting Electronics Packaging Market Analysis

• Through-hole mounting electronics packaging involves inserting component leads through holes in printed circuit boards (PCBs) and soldering them to pads on the opposite side, providing robust mechanical and electrical connections suitable for components requiring high durability and heat dissipation
• The demand for through-hole mounting is driven by its reliability in harsh environments, ease of repair and maintenance, and suitability for high-power applications, particularly in aerospace, defense, and automotive sectors
• Asia-Pacific dominated the through hole mounting electronics packaging market with the largest revenue share in 2024, attributed to its robust electronics manufacturing ecosystem, significant presence of key industry players, and rising consumer demand for electronics in countries such as China, Japan, and India
• Europe is expected to be the fastest-growing region during the forecast period, fueled by the expansion of the automotive sector, increasing demand for consumer electronics, and efforts to enhance semiconductor production capacity
• The Plastic segment dominated the largest market revenue share of 35% in 2024, driven by its cost-effectiveness, lightweight properties, and versatility in consumer electronics, automotive, and telecommunication applications. Plastic packaging ensures insulation and protection against moisture and dust, making it ideal for various electronic components

Report Scope and Through Hole Mounting Electronics Packaging Market Segmentation

Through Hole Mounting Electronics Packaging Market Trends

“Increasing Adoption of Advanced Materials and Miniaturization”

• The through hole mounting electronics packaging market is experiencing a significant trend toward the use of advanced materials such as high-performance plastics, metals, and glass to enhance durability and thermal management.
• These materials are critical for supporting the miniaturization of electronic components, enabling more compact and efficient designs in consumer electronics, automotive, and aerospace applications.
• Advanced materials such as polyphenylene sulfide (PPS) and ceramics provide excellent electrical insulation and resistance to extreme conditions, making them ideal for through-hole mounting in high-reliability systems.
• For instance, companies are developing metal-based packaging solutions for aerospace and defense applications to ensure robust connections under harsh environmental conditions such as vibrations and extreme temperatures.
• This trend enhances the reliability and longevity of through-hole mounting systems, making them more appealing for industries requiring high durability, such as automotive and telecommunications.
• Material innovations are also enabling through-hole components to support complex circuit designs while maintaining mechanical strength and ease of repair.

Through Hole Mounting Electronics Packaging Market Dynamics

Driver

“Growing Demand for Reliable and Repairable Electronics in Critical Applications”

• The increasing need for robust and reliable electronic systems in industries such as aerospace and defense, automotive, and telecommunications is a major driver for the Global Through Hole Mounting Electronics Packaging Market.
• Through-hole mounting provides secure mechanical and electrical connections, making it ideal for components requiring high durability, such as connectors, resistors, and capacitors used in critical systems.
• Government regulations, particularly in Europe, mandating enhanced safety and reliability standards in automotive and aerospace electronics, are boosting the adoption of through-hole technology.
• The rise of IoT and 5G technology is further expanding the use of through-hole mounting in telecommunications for stable and high-performance connections in base stations and network infrastructure.
• Manufacturers are increasingly integrating through-hole mounting in automotive electronics for applications such as powertrain control and advanced driver-assistance systems (ADAS), where reliability is paramount.
• Asia-Pacific dominates the market due to its robust electronics manufacturing base, with countries such as China, Japan, and Taiwan driving demand for through-hole packaging solutions

Restraint/Challenge

“High Costs and Shift Toward Surface-Mount Technology”

• The high initial costs associated with through-hole mounting, including specialized equipment, labor-intensive assembly processes, and material expenses, pose a significant barrier, particularly in cost-sensitive markets such as consumer electronics.
• Integrating through-hole components into modern, compact circuit designs can be complex and costly compared to surface-mount technology (SMT), which supports higher-density component placement.
• The growing preference for SMT due to its automation capabilities and suitability for miniaturized electronics is limiting the growth of through-hole mounting in some applications.
• Data security concerns related to connected devices in telecommunications and automotive sectors, which often use through-hole components, raise issues about compliance with global data protection regulations.
• The fragmented regulatory landscape across regions, particularly in Asia-Pacific and Europe, complicates standardization and increases operational challenges for manufacturers.
• These factors can deter adoption in price-sensitive regions and applications, despite the reliability advantages of through-hole mounting, particularly where SMT is more cost-effective.

Through Hole Mounting Electronics Packaging market Scope

The market is segmented on the basis of material and end-user.

• By Material

On the basis of material, the global through hole mounting electronics packaging market is segmented into plastic, metal, glass, and others. The Plastic segment dominated the largest market revenue share of 35% in 2024, driven by its cost-effectiveness, lightweight properties, and versatility in consumer electronics, automotive, and telecommunication applications. Plastic packaging ensures insulation and protection against moisture and dust, making it ideal for various electronic components.

The metal segment is expected to witness the fastest growth rate from 2025 to 2032, driven by increasing demand for durable and thermally efficient materials in high-power electronics, particularly in aerospace and defense and automotive sectors. Advanced metal alloys such as aluminum and copper are used for heat sinks and shielding, enhancing thermal management and electromagnetic interference (EMI) protection.

• By End-User

On the basis of end-user, the global through hole mounting electronics packaging market is segmented into consumer electronics, aerospace and defense, automotive, telecommunication, and others. The consumer electronics segment dominated the market with a revenue share of 36.39% in 2024, driven by the high demand for smartphones, tablets, and other compact devices requiring reliable and robust connections. Through-hole mounting ensures secure mechanical and electrical connections for components such as resistors and capacitors, supporting the durability needs of consumer electronics.

The automotive segment is anticipated to witness the fastest growth rate from 2025 to 2032. This growth is fueled by the increasing adoption of electronics in modern vehicles, including advanced driver-assistance systems (ADAS), infotainment systems, and electric vehicle components, all of which necessitate robust and high-performance through-hole mounting packaging for long-term reliability in harsh automotive environments.

Through Hole Mounting Electronics Packaging Market Regional Analysis

• Asia-Pacific dominated the through hole mounting electronics packaging market with the largest revenue share in 2024, attributed to its robust electronics manufacturing ecosystem, significant presence of key industry players, and rising consumer demand for electronics in countries such as China, Japan, and India
• Consumer demand focuses on durable and cost-effective packaging solutions that ensure component stability, thermal management, and protection against environmental factors, particularly in regions with high electronics production
• Market growth is supported by advancements in packaging materials, such as high-performance plastics and metals, and growing adoption in both consumer electronics and industrial applications

Japan Through Hole Mounting Electronics Packaging Market Insight

Japan’s market is expected to witness significant growth due to strong consumer and industrial preference for high-quality, durable packaging solutions that enhance component performance and longevity. The presence of major electronics manufacturers and integration of advanced packaging in OEM products accelerate market penetration. Rising interest in customized solutions also contributes to growth.

China Through Hole Mounting Electronics Packaging Market Insight

China holds the largest share of the Asia-Pacific through hole mounting electronics packaging market, propelled by rapid urbanization, increasing electronics consumption, and strong demand for reliable packaging solutions. The country’s growing manufacturing capabilities and focus on cost-effective, high-performance materials support adoption. Competitive pricing and robust domestic production enhance market accessibility.

North America Through Hole Mounting Electronics Packaging Market Insight

North America holds a significant share in the global through hole mounting electronics packaging market in 2024, driven by a mature electronics industry and increasing demand for reliable packaging solutions in consumer electronics, automotive, and aerospace sectors. The U.S. leads the region, with strong adoption fueled by technological advancements and regulatory standards emphasizing component safety and durability. Growth is further supported by the integration of advanced packaging in both OEM and aftermarket applications, particularly in high-performance electronics.

U.S. Through Hole Mounting Electronics Packaging Market Insight

The U.S. through hole mounting electronics packaging market is expected to witness significant growth, fueled by strong demand in consumer electronics and aerospace sectors. The trend toward reliable, long-lasting packaging solutions and increasing regulations for electronic component safety drive market expansion. The integration of advanced packaging in automotive and defense applications complements aftermarket growth, creating a diverse ecosystem.

Europe Through Hole Mounting Electronics Packaging Market Insight

The Europe market is expected to witness the fastest growth rate, supported by stringent regulations on electronic component safety and reliability. Consumers and industries seek packaging solutions that enhance thermal dissipation and durability. Growth is notable in both new product designs and retrofit projects, with countries such as Germany and France showing significant adoption due to environmental concerns and advanced manufacturing needs.

U.K. Through Hole Mounting Electronics Packaging Market Insight

The U.K. market is projected to experience rapid growth, driven by demand for high-quality packaging in consumer electronics and telecommunications. Increased focus on component reliability and miniaturization in urban settings boosts adoption. Evolving safety standards and environmental regulations influence material choices, balancing performance with compliance.

Germany Through Hole Mounting Electronics Packaging Market Insight

Germany is expected to witness the fastest growth rate in the European market, attributed to its advanced electronics and automotive manufacturing sectors. German industries prioritize technologically advanced packaging materials that improve thermal management and contribute to energy efficiency. The integration of these solutions in premium electronics and automotive applications supports sustained market growth.

Through Hole Mounting Electronics Packaging Market Share

The through hole mounting electronics packaging industry is primarily led by well-established companies, including:

• AMETEK.Inc. (U.S.)
• Dordan Manufacturing Company, Incorporated (U.S.)
• DuPont (U.S.)
• The Plastiform Company (U.S.)
• Kiva Container (U.S.)
• Primex Plastics Corporation. (Canada)
• Quality Foam Packaging, Inc. (U.S.)
• Ameson Packaging (U.S.)
• Lithoflex, Inc. (U.S.)
• UFP Technologies, Inc. (U.S.)
• Intel Corporation (U.S.)
• STMicroelectronics (Switzerland)
• Advanced Micro Devices, Inc (U.S.)
• SAMSUNG (South Korea)
• ams-OSRAM AG (Austria)
• GY Packaging (South Carolina)
• Taiwan Semiconductor (Taiwan)

What are the Recent Developments in Global Through Hole Mounting Electronics Packaging Market?

• In September 2024, Scrona AG and Electroninks announced a strategic partnership to advance materials and process development for semiconductor packaging. Electroninks will supply its metal-organic decomposition (MOD) inks—including silver, gold, and copper—to be used with Scrona’s MEMS-based electrohydrodynamic (EHD) multi-nozzle printhead technology. The collaboration targets high-precision applications such as RDL repair, fine line metallization, via filling, and 3D interconnects. Joint R&D efforts will be conducted at Scrona’s Zurich lab and a regional technology center in Taiwan, aiming to accelerate innovation in high-performance, miniaturized semiconductor devices
• In May 2024, American Packaging Corporation (APC) announced the opening of its second production unit for digitally printed flexible packaging at its Wisconsin Center of Excellence. The new facility features cutting-edge digital printing, laminating, registered coating, and pouch-making technologies, designed to enable rapid order fulfillment—often within 15 days. While not exclusively focused on through-hole components, the expansion enhances APC’s capabilities to support a wide range of applications, including electronics, food, and pharmaceuticals. This investment reflects APC’s commitment to innovation, speed, and sustainability in flexible packaging
• In January 2024, INEOS Styrolution launched Zylar EX350, a new grade of methyl methacrylate butadiene styrene (MBS) materials designed specifically for electronics component packaging. Zylar EX350 offers a balanced combination of stiffness and toughness, making it ideal for carrier tapes used in tape-and-reel packaging, including components destined for through-hole and surface mount assembly. The material enables the creation of deeper, more rigid pocket designs compared to traditional GPPS/SBC blends, improving component stability and inspection visibility. This innovation enhances protection, reduces mis-picks, and supports broader design flexibility in semiconductor packaging
• In September 2023, SCHOTT announced the launch of lightweight microelectronic packages specifically engineered for the aerospace industry. These new hermetic packages, made from aluminum, reduce weight by up to two-thirds compared to traditional Kovar-based packaging, while maintaining the same level of robust protection for sensitive avionics. Designed for demanding environments such as aircraft and satellite systems, the packages are ideal for applications such as microwave/RF modules, DC/DC converters, and hermetic sensors. This innovation supports critical aerospace needs, where through-hole components are often preferred for their durability and reliability
• In March 2023, a report from the Organic and Printed Electronics Association (OE-A) highlighted the rapid adoption of flexible electronics, particularly in wearables, as a major driver for innovation in electronic packaging. This trend is accelerating the development of lightweight, flexible packaging materials that can accommodate the unique form factors of bendable and stretchable devices. While surface-mount technology (SMT) dominates in flexible electronics, the evolution of hybrid systems and advanced materials is also influencing the design and protection of through-hole components in more complex assemblies, such as medical wearables and industrial sensors

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