- Through-hole mounting electronics packaging involves inserting component leads through holes in printed circuit boards (PCBs) and soldering them to pads on the opposite side, providing robust mechanical and electrical connections suitable for components requiring high durability and heat dissipation
- The demand for through-hole mounting is driven by its reliability in harsh environments, ease of repair and maintenance, and suitability for high-power applications, particularly in aerospace, defense, and automotive sectors
- Asia-Pacific dominated the through hole mounting electronics packaging market with the largest revenue share in 2024, attributed to its robust electronics manufacturing ecosystem, significant presence of key industry players, and rising consumer demand for electronics in countries such as China, Japan, and India
- Europe is expected to be the fastest-growing region during the forecast period, fueled by the expansion of the automotive sector, increasing demand for consumer electronics, and efforts to enhance semiconductor production capacity
- The Plastic segment dominated the largest market revenue share of 35% in 2024, driven by its cost-effectiveness, lightweight properties, and versatility in consumer electronics, automotive, and telecommunication applications. Plastic packaging ensures insulation and protection against moisture and dust, making it ideal for various electronic components
