- In September 2024, Scrona AG and Electroninks announced a strategic partnership to advance materials and process development for semiconductor packaging. Electroninks will supply its metal-organic decomposition (MOD) inks—including silver, gold, and copper—to be used with Scrona’s MEMS-based electrohydrodynamic (EHD) multi-nozzle printhead technology. The collaboration targets high-precision applications such as RDL repair, fine line metallization, via filling, and 3D interconnects. Joint R&D efforts will be conducted at Scrona’s Zurich lab and a regional technology center in Taiwan, aiming to accelerate innovation in high-performance, miniaturized semiconductor devices
- In May 2024, American Packaging Corporation (APC) announced the opening of its second production unit for digitally printed flexible packaging at its Wisconsin Center of Excellence. The new facility features cutting-edge digital printing, laminating, registered coating, and pouch-making technologies, designed to enable rapid order fulfillment—often within 15 days. While not exclusively focused on through-hole components, the expansion enhances APC’s capabilities to support a wide range of applications, including electronics, food, and pharmaceuticals. This investment reflects APC’s commitment to innovation, speed, and sustainability in flexible packaging
- In January 2024, INEOS Styrolution launched Zylar EX350, a new grade of methyl methacrylate butadiene styrene (MBS) materials designed specifically for electronics component packaging. Zylar EX350 offers a balanced combination of stiffness and toughness, making it ideal for carrier tapes used in tape-and-reel packaging, including components destined for through-hole and surface mount assembly. The material enables the creation of deeper, more rigid pocket designs compared to traditional GPPS/SBC blends, improving component stability and inspection visibility. This innovation enhances protection, reduces mis-picks, and supports broader design flexibility in semiconductor packaging
- In September 2023, SCHOTT announced the launch of lightweight microelectronic packages specifically engineered for the aerospace industry. These new hermetic packages, made from aluminum, reduce weight by up to two-thirds compared to traditional Kovar-based packaging, while maintaining the same level of robust protection for sensitive avionics. Designed for demanding environments such as aircraft and satellite systems, the packages are ideal for applications such as microwave/RF modules, DC/DC converters, and hermetic sensors. This innovation supports critical aerospace needs, where through-hole components are often preferred for their durability and reliability
- In March 2023, a report from the Organic and Printed Electronics Association (OE-A) highlighted the rapid adoption of flexible electronics, particularly in wearables, as a major driver for innovation in electronic packaging. This trend is accelerating the development of lightweight, flexible packaging materials that can accommodate the unique form factors of bendable and stretchable devices. While surface-mount technology (SMT) dominates in flexible electronics, the evolution of hybrid systems and advanced materials is also influencing the design and protection of through-hole components in more complex assemblies, such as medical wearables and industrial sensors
