Global Through Hole Mounting Electronics Packaging Market, By Material (Plastic, Metal, Glass, Others), End-User (Consumer Electronics, Aerospace and Defense, Automotive, Telecommunication, Others) – Industry Trends and Forecast to 2029.
Through Hole Mounting Electronics Packaging Market Analysis and Size
Rising demand for the consumer electronics across the globe is the primary factor driving the growth of the through hole mounting electronics packaging market over the forecasted period from 2022-2029. Additionally, the market is growing due to increased adoptions of smartphones and the era of digitalization across the globe. The essential methodologies to produce cutting-edge solutions for the integration of flexible electronics will create certain significant lucrative growth opportunities for the through hole mounting electronics packaging market over the forecasted period.
Global through hole mounting electronics packaging market was valued at USD 25,394.40 million in 2021 and is expected to reach USD 84408.66 million by 2029, registering a CAGR of 16.20% during the forecast period of 2022-2029. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.
Through Hole Mounting Electronics Packaging Market Scope and Segmentation
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Report Metric
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Details
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Forecast Period
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2022 to 2029
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Base Year
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2021
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Historic Years
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2020 (Customizable to 2014 - 2019)
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Quantitative Units
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Revenue in USD Million, Volumes in Units, Pricing in USD
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Segments Covered
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Material (Plastic, Metal, Glass, Others), End-User (Consumer Electronics, Aerospace and Defense, Automotive, Telecommunication, Others)
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Countries Covered
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U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America
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Market Players Covered
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AMETEK.Inc. (U.S.), Dordan Manufacturing Company, Incorporated. (U.S.), DuPont. (U.S.), The Plastiform Company (U.S.), Kiva Container (U.S.), Primex Plastics Corporation. (Canada), Quality Foam Packaging, Inc. (U.S.), Ameson Packaging. (U.S.), Lithoflex, Inc. (U.S.), UFP Technologies, Inc. (U.S.), Intel Corporation (U.S.), STMicroelectronics (Switzerland), Advanced Micro Devices, Inc (U.S.), SAMSUNG (South Korea), ams-OSRAM AG. (Austria), GY Packaging. (South Carolina), Taiwan Semiconductor (Taiwan)
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Market Opportunities
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Market Definition
Through hole mounting is the process by which the component leads are packed into the drilled holes on a bare printed circuit board. The through hole electronic packaging offers number of advantages such as high-reliability, easy to solder/desolder and test and others. It also provides interconnections between upper and lower layers (vias) in non-plated hole technologies.
Global Through Hole Mounting Electronics Packaging Market Dynamics
This section deals with understanding the market drivers, advantages, opportunities, restraints and challenges. All of this is discussed in detail as below:
Drivers
- Rising demands in electronics
The through hole mounting electronics packaging market is driven by the increased adoption of the electronic gadgets such as the smartphones, gadgets, wearable devices, tablets, televisions, digital cameras that include new packaging materials such as air-bubbled wraps and air pillows to protect it from harsh weather conditions. The demands of all-weather protective packaging equipments such as routers, network servers and others is also fueling the growth of the market over the forecasted period. All these factors are driving the growth of the through hole mounting electronics packaging market over the forecasted period.
- Increased adoptions of smartphones and the era of digitalization
The increased adoptions of smartphones across the globe is the primary factor driving the growth of the market over the forecasted period. Moreover, the growing use of internet of thinking (IoT) devices and the development of these technologies are fueling the market's growth. These factors are driving the growth of the through hole mounting electronics packaging market over the forecasted period.
Opportunities
- Essential methodologies and high demand across various end-users
The growing essential methodologies to produce the cutting-edge solutions for the integration of flexible electronics, such as high capacity batteries to provide compact electronic packaging is creating certain lucrative growth factors for the through hole mounting electronic packaging market over the forecasted period. Moreover, the demand for high-quality military grade packaging in the aerospace and defense sector for naval warships, aircraft guidance and others are also certain factors creating significant growth opportunities for the through hole mounting electronics packaging market over the forecasted period.
Restraints/Challenges
- High Costs and heat dissipation
The initial high costs of the electronic packaging technology and decreasing market players are the worries about heat dissipation, is expected to obstruct market growth.
- Stress sensitivity and difficulty in repairs
The main drawback is the potential reliability difficulties, such as stress sensitivity and complicated, difficulty in defect repair after the components are soldered into circuit boards. This factor is projected to be challenge for the through hole mounting electronics packaging market over the forecast period.
This through hole mounting electronics packaging market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the through hole mounting electronics packaging market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays
Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.
Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.
Expected Impact of Economic Slowdown on the Pricing and Availability of Products
When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.
Global Through Hole Mounting Electronics Packaging Market Scope
The through hole mounting electronics packaging market is segmented on the basis of material and end use. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.
Material
- Plastic
- Metal
- Glass
- Others
End-User
- Consumer Electronics
- Aerospace and Defense
- Automotive
- Telecommunication
- Others
Through Hole Mounting Electronics Packaging Market Regional Analysis/Insights
The through hole mounting electronics packaging market is analyzed and market size insights and trends are provided by material and end use as referenced above.
The countries covered in the through hole mounting electronics packaging market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America
Asia-Pacific dominates the through hole mounting electronics packaging market because of the growing prevalence of the manufacturing companies along with the rising disposable income of the growing population within the region.
Europe is expected to witness significant growth during the forecast period of 2022 to 2029 due to the expansion of the automobile sector along with the rising demand of the consumer electronics and the increasing production capacity of the semiconductor devices within the region.
The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Through Hole Mounting Electronics Packaging Market Share Analysis
The through hole mounting electronics packaging market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to through hole mounting electronics packaging market.
Some of the major players operating in the through hole mounting electronics packaging market are
- AMETEK.Inc. (U.S.)
- Dordan Manufacturing Company, Incorporated. (U.S.)
- DuPont. (U.S.)
- The Plastiform Company (U.S.)
- Kiva Container (U.S.)
- Primex Plastics Corporation. (Canada)
- Quality Foam Packaging, Inc. (U.S.)
- Ameson Packaging. (U.S.)
- Lithoflex, Inc. (U.S.)
- UFP Technologies, Inc. (U.S.)
- Intel Corporation (U.S.)
- STMicroelectronics (Switzerland)
- Advanced Micro Devices, Inc (U.S.)
- SAMSUNG (South Korea)
- ams-OSRAM AG. (Austria)
- GY Packaging. (South Carolina)
- Taiwan Semiconductor (Taiwan)
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