Press Release

Dec, 14 2023

Diverse Growth Trajectories: Potting and Encapsulating Compounds Market Flourishes with Varied Types and Substrates

The potting and encapsulating compounds market showcases diverse growth with types such as epoxy, polyurethane, silicone, polyester system, polyamide, polyolefin, and more. These compounds find applications across substrates such as glass, metal, ceramic, and others. Epoxy and silicone dominate due to their versatile properties, meeting various industry needs. The market's expansion is fueled by increasing demand, especially in high-power devices, and the choice of substrates reflects the compounds' adaptability across a spectrum of materials, ensuring comprehensive solutions for different applications.

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Data Bridge Market Research analyses that the Global Potting and Encapsulating Compounds Market is expected to reach USD 48,84,404.669 thousand by 2030, which is USD 33,05,957.34 thousand in 2022, registering a CAGR of 5.00% during the forecast period of 2023 to 2030. The surge in demand for eco-friendly potting and encapsulating compounds, especially in the transportation sector, is a key driver fueling market expansion. As environmental consciousness grows, industries prioritize sustainable solutions, driving the adoption of compounds with reduced environmental impact and enhancing overall market growth.

Key Findings of the Study

Potting and Encapsulating Compounds Market

Increasing industry demand is expected to drive the market's growth rate

The escalating demand within various industries stems from the indispensable role of potting and encapsulating compounds in safeguarding electronic components, ensuring their reliability, and extending operational life. These compounds shield sensitive electronics from environmental factors, enhancing durability and performance. As industries prioritize robust protection for electronic systems, the heightened industry demand for these compounds underscores their critical contribution to the reliability and longevity of electronic devices, driving significant growth in the potting and encapsulating compounds market.

Report Scope and Market Segmentation

Report Metric

Details

Forecast Period

2023 to 2030

Base Year

2022

Historic Years

2021 (Customizable to 2015-2020)

Quantitative Units

Revenue in USD Thousand, Volumes in Units, Pricing in USD

Segments Covered

Type (Epoxy, Polyurethane, Silicone, Polyester System, Polyamide, Polyolefin, and Others), Substrate Type (Glass, Metal, Ceramic, Others), Function (Electrical Insulation, Heat Dissipation, Corrosion Protection, Shock Resistance, Chemical Protection, Others), Curing Technique (Room Temperature Cured, High Temperature or Thermally Cured, UV Cured), Distribution Channel (Offline, Online), Application (Electronics, Electrical) and End-User industry (Transportation, Consumer Electronics, Energy and Power, Telecommunication, Healthcare, Others)

Countries Covered

U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.

Market Players Covered

3M (U.S.), DuPont (U.S.), PARKER HANNIFIN CORP (U.S.), Momentive (U.S.), Henkel AG and Co. KgaA (Germany), Solvay (Belgium), Avantor, Inc. (U.S.), ELANTAS (Germany), Electrolube (U.K.), Epoxies, Etc. (U.S.), Dymax (U.S.), Master Bond Inc. (U.S.), Owens Corning (U.S.), DELO (U.S.), RBC Industries, Inc. (U.S.), Hernon Manufacturing (U.S.), ITW Performance Polymers (U.S.), Creative Materials (U.S.), United Resin, Inc. (U.S.), Epic Resins (U.S.)

Data Points Covered in the Report

In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.

Segment Analysis:

The global potting and encapsulating compounds market is segmented on the basis of type, substrate type, function, curing technique, distribution channel, application, and end-user.

  • On the basis of type, the global potting and encapsulating compounds market is segmented into epoxy, polyurethane, silicone, polyester system, polyamide, polyolefin, and others. The epoxy segment is expected to dominate the potting and encapsulating compounds market with a 30.98% market share due to its versatile properties, offering robust protection for electronic components

The epoxy segment of the type segment is expected to dominate the potting and encapsulating compounds market during the forecast period of 2023-2030

The epoxy segment is expected to dominate the potting and encapsulating compounds market with a 30.98% market share due to its versatile properties, offering robust protection for electronic components. Widely utilized in various industries, epoxy compounds provide effective encapsulation, insulation, and durability, making them a preferred choice and driving market leadership.

  • On the basis of substrate type, the global potting and encapsulating compounds market is segmented into glass, metal, ceramic, and others. The metal segment is expected to dominate the potting and encapsulating compounds market with a 37.52% market share, signifying the prominence of compounds suitable for encapsulating electronic components on metal substrates

The metal segment of the substrate type is expected to dominate the potting and encapsulating compounds market during the forecast period of 2023-2030

The metal segment is expected to dominate the potting and encapsulating compounds market with a 37.52% market share, signifying the prominence of compounds suitable for encapsulating electronic components on metal substrates. This dominance is driven by the wide applicability and effectiveness of metal-compatible compounds in diverse industrial settings.

  • On the basis of function, the global potting and encapsulating compounds market is segmented into electrical insulation, heat dissipation, corrosion protection, shock resistance, chemical protection, and others. The electrical insulation segment is expected to dominate the potting and encapsulating compounds market with a 31.15% market share, emphasizing the critical role in safeguarding electronic components from electrical interference
  • On the basis of curing technique, the global potting and encapsulating compounds market is segmented into room temperature cured, high temperature or thermally cured, and UV cured. The UV Cured segment is expected to dominate the potting and encapsulating compounds market with a 45.08% market share, highlighting its efficiency and rapid curing properties
  • On the basis of distribution channel, the global potting and encapsulating compounds market is segmented into offline, and online. The offline segment is expected to dominate the potting and encapsulating compounds market with 60.09% market share, indicating a preference for traditional distribution channels over online platforms
  • On the basis of application, the global potting and encapsulating compounds market is segmented into electronics, and electrical. The electrical segment is expected to dominate the potting and encapsulating compounds market with a 56.31% market share, emphasizing its significance in safeguarding electronic components from interference
  • On the basis of end-user, the global potting and encapsulating compounds market is segmented into transportation, consumer electronics, energy and power, telecommunication, healthcare, and others. the electronics segment is expected to dominate the potting and encapsulating compounds market with a 25.46% market share, underscoring its pivotal role in protecting electronic components

Major Players

Data Bridge Market Research recognizes the following companies as the global potting and encapsulating compounds market players in global potting and encapsulating compounds market are 3M (U.S.), DuPont (U.S.), PARKER HANNIFIN CORP (U.S.), Momentive (U.S.), Henkel AG and Co. KgaA (Germany), Solvay (Belgium), Avantor, Inc. (U.S.).

Potting and Encapsulating Compounds Market

Market Developments

  • In 2021, Master Bond Inc. expanded its product line with the introduction of MasterSil 153AO. This innovative two-part silicone features self-priming capabilities and a cured structure that is both electrically insulating and thermally conductive. The launch of MasterSil 153AO is part of the company's strategy to diversify its product portfolio, providing customers with advanced solutions for applications requiring electrical insulation and thermal conductivity
  • In 2020, Electrolube announced the success of its ER2221 resin, designed to protect electric vehicle batteries in India's popular two-wheeler cars. This product launch addressed thermal management challenges, offering Indian customers an effective solution. By enhancing the protection and performance of electric vehicle batteries, Electrolube contributed to the advancement of sustainable transportation and the growing electric vehicle market in India
  • In 2020, Epoxies Etc. introduced the 20-3305 epoxy, specifically formulated to address high-voltage electronic requirements and provide protection against stress and heat cycling for electronic assemblies. The launch aimed to diversify their product portfolio, offering a solution that enhances thermal shock resistance. This epoxy product caters to the evolving demands of electronic applications, contributing to improved reliability and performance in high-stress environments

Regional Analysis

Geographically, the countries covered in the global potting and encapsulating compounds market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.

As per Data Bridge Market Research analysis:

North America is the dominant region in the global potting and encapsulating compounds market during the forecast period 2023-2030

North America dominates the market from 2023 to 2030, driven by a rising need for potting and encapsulating compounds in high-power devices. The region's demand is propelled by the growing adoption of eco-friendly compounds in the transportation sector. This trend, coupled with technological advancements, positions North America as the fastest-developing market for potting and encapsulating compounds, meeting the evolving requirements of high-power electronic devices and promoting sustainability in the transportation industry. 

Asia-Pacific is expected to dominate the global potting and encapsulating compounds market in the forecast period 2023-2030

Asia-Pacific is expected to dominate the potting and encapsulating compounds market due to surging demand for consumer electronics. The region benefits from the ease of manufacturing and installing these compounds, supported by high-quality raw materials. As consumer electronics continue to thrive in Asia-Pacific, the market experiences substantial growth. The combination of increasing demand and efficient production processes positions the region as a key player in the potting and encapsulating compounds market.

For more detailed information about the global potting and encapsulating compounds market report, click here – https://www.databridgemarketresearch.com/reports/global-potting-and-encapsulating-compounds-market


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