Global Radiation-Hardened Electronics Market, By Component (Microprocessors and Controllers, Discrete Semiconductors, Power Sources, Memory, Sensors, Field-Programmable Gate Array, Application Specific Integrated Circuit, Analog and Mixed Signals, Optoelectronics, Others), Material (Silicon, Hydrogenated Amorphous Silicon, Silicon Carbide, Gallium Nitride, Gallium Arsenide, Others), Manufacturing Technique (Rad-Hard by Design, Rad-Hard by Process, Radiation Hardening by Software), Product Type (Custom-made, Commercial-Off-The-Shelf (COTS)), Application (Space, Aerospace and Defense, Nuclear Power Plants, Medical, Others), Country (U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa) Industry Trends and Forecast to 2028
Market Analysis and Insights: Global Radiation-Hardened Electronics Market
Radiation-hardened electronics market size is valued at USD 1.80 billion by 2028 is expected to grow at a compound annual growth rate of 3.10% in the forecast period of 2021 to 2028. Data Bridge Market Research report on radiation-hardened electronics provides analysis and insights regarding the various factors expected to be prevalent throughout the forecasted period while providing their impacts on the market’s growth.
Radiation-hardened electronics are the type of various electronic components, packages and products that are mainly used for high-altitude applications. These components are defiant to the damage caused by high-energy radiations and ionizing, gamma and neutron radiation produced by nuclear reactors.
The rise in the intelligence, surveillance, and reconnaissance (ISR) operations across the globe is expected to influence the growth of radiation-hardened electronics market over the forecast period of 2021 to 2028. Also the rapid advancements in field-programming gate arrays (FPGAs) and the multicore processor technologies for military and space applications are also anticipated to flourish the growth of the radiation-hardened electronics market. Furthermore, the high demand for radiation-hardened electronics in the communication satellite segment and the increase in the demand for electronic systems which can endure significant radiation exposure in nuclear power industry are also likely to positively impact the growth of the market. Moreover, the increase in the number of the space missions and the rapid technological advancements are also expected create a huge demand for radiation-hardened electronics as well as lifting the growth of the radiation-hardened electronics market.
However, the complexity in creating an actual testing environment and high costs of development and designing are expected to act as the major limitations for the growth of radiation-hardened electronics in the above mentioned forecasted period, whereas the personalized requirements of high-end consumers can challenge the radiation-hardened electronics market growth in the forecast period of 2021 to 2028.
Likewise, the increase in the research and development activities, rise in the requirements for reconfigurable radiation-hardened components and the rise in the use of commercial-off-the-shelf products in satellites and other space applications are expected to create various new opportunities that will lead to the growth of the radiation-hardened electronics market in the above mentioned forecasted period.
This radiation-hardened electronics market report provides details of new recent developments, trade regulations, import export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on radiation-hardened electronics market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Global Radiation-Hardened Electronics Market Scope and Market Size
Radiation-hardened electronics market is segmented on the basis of component, material, manufacturing technique, product type and application. The growth among segments helps you analyze niche pockets of growth and strategies to approach the market and determine your core application areas and the difference in your target markets.
- On the basis of component, the radiation-hardened electronics market is segmented into microprocessors and controllers, discrete semiconductors, power sources, memory, sensors, field-programmable gate array, application specific integrated circuit, analog and mixed signals, optoelectronics and others.
- On the basis of material, the radiation-hardened electronics market is segmented into silicon, hydrogenated amorphous silicon, silicon carbide, gallium nitride, gallium arsenide and others.
The manufacturing technique segment of the radiation-hardened electronics market is segmented into rad-hard by design, rad-hard by process and radiation hardening by software.
- Based on product type, the radiation-hardened electronics market is segmented into custom-made and commercial-off-the-shelf (COTS).
- Based on application, the radiation-hardened electronics market is segmented into space, aerospace and defense, nuclear power plants, medical and others.
Radiation-Hardened Electronics Market Country Level Analysis
Radiation-hardened electronics market is analyzed and market size, volume information is provided by country, component, material, manufacturing technique, product type and application as referenced above.
The countries covered in the radiation-hardened electronics market report are U.S., Canada and Mexico in North America, Brazil, Argentina and Rest of South America as part of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe in Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA)as a part of Middle East and Africa (MEA).
North America leads the radiation-hardened electronics market due to the presence of rad-hard component manufacturers. Asia-Pacific is expected to expand at a significant growth rate of over the forecast period of 2021 to 2028 owing to the cutting-edge manufacturing technological abilities and developing economic conditions in India, China and Japan.
The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Radiation-Hardened Electronics Market Share Analysis
Radiation-hardened electronics market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, regional presence, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to radiation-hardened electronics market.
The major players covered in the radiation-hardened electronics market report are BAE Systems, Microchip Technology Inc., Infineon Technologies AG, STMicroelectronics, Renesas Electronics Corporation, Xilinx, Inc., Texas Instruments Incorporated, MAXWELL TECHNOLOGIES, INC., Analog Devices, Inc., pSemi, Teledyne Technologies Inc., Cobham Limited, Boeing, TT Electronics, Data Device Corporation, Honeywell International Inc., Microsemi, VORAGO Technologies, Ridgetop Group, Inc., and VPT, Inc., among other domestic and global players. Market share data is available for global, North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America separately. DBMR analysts understand competitive strengths and provide competitive analysis for each competitor separately.
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