1 INTRODUCTION
1.1 OBJECTIVES OF THE STUDY
1.2 MARKET DEFINITION
1.3 OVERVIEW OF GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET
1.4 CURRENCY AND PRICING
1.5 LIMITATION
1.6 MARKETS COVERED
2 MARKET SEGMENTATION
2.1 KEY TAKEAWAYS
2.2 ARRIVING AT THE GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET
2.3 VENDOR POSITIONING GRID
2.4 TECHNOLOGY LIFE LINE CURVE
2.5 MARKET GUIDE
2.6 MULTIVARIATE MODELLING
2.7 TOP TO BOTTOM ANALYSIS
2.8 STANDARDS OF MEASUREMENT
2.9 VENDOR SHARE ANALYSIS
2.1 DATA POINTS FROM KEY PRIMARY INTERVIEWS
2.11 DATA POINTS FROM KEY SECONDARY DATABASES
2.12 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET: RESEARCH SNAPSHOT
2.13 ASSUMPTIONS
3 MARKET OVERVIEW
3.1 DRIVERS
3.2 RESTRAINTS
3.3 OPPORTUNITIES
3.4 CHALLENGES
4 EXECUTIVE SUMMARY
5 PREMIUM INSIGHTS
5.1 PORTERS FIVE FORCES
5.2 REGULATORY STANDARDS
5.3 TECHNOLOGICAL TRENDS
5.4 GROWTH SECTOR IN AUTOMOTIVE INDUSTRY
5.4.1 ELECTRIC VEHICLE
5.4.2 AUTONOMOUS VEHICLE
5.4.3 CONNECTED VEHICLE
5.4.4 MOBILITY AS A SERVICE
5.5 VALUE CHAIN ANALYSIS
5.6 PATENT ANALYSIS
5.7 COMPANY COMPARITIVE ANALYSIS
6 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY COMPONENT
6.1 OVERVIEW
6.2 PROCESSOR
6.2.1 MICROPROCESSOR UNITS (MPUS)
6.2.2 MICROCONTROLLER UNITS (MCUS)
6.2.3 DIGITAL SIGNAL PROCESSORS (DSPS)
6.2.4 GRAPHIC PROCESSING UNITS (GPUS)
6.3 ANALOG IC
6.3.1 ASICS AND ASSPS
6.3.2 AMPLIFIERS
6.3.3 INTERFACES
6.3.4 LOGIC ICS
6.3.5 CONVERTORS
6.3.6 COMPARATORS
6.3.7 INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES
6.4 DISCRETE POWER DEVICES
6.4.1 POWER TRANSISTORS
6.4.2 SMALL SIGNAL TRANSISTORS
6.4.3 RECTIFIERS AND DIODES
6.4.4 THYRISTORS
6.5 SENSOR
6.5.1 IMAGE SENSORS
6.5.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS
6.5.1.2. CHARGE-COUPLED DEVICES (CCDS)
6.5.2 INERTIAL SENSORS
6.5.2.1. ACCELEROMETERS
6.5.2.2. GYROSCOPES
6.5.3 PRESSURE SENSORS
6.5.4 TEMPERATURE SENSORS
6.5.5 RADARS
6.5.6 OTHERS
6.6 MEMORY DEVICE
6.6.1 DYNAMIC RANDOM-ACCESS MEMORY (DRAM)
6.6.2 STATIC RANDOM-ACCESS MEMORY (SRAM)
6.7 LIGHTING DEVICE
7 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY FUEL TYPE
7.1 OVERVIEW
7.2 GASOLINE
7.3 DIESEL
7.4 ELECTRIC VEHICLE
7.4.1 BATTERY ELECTRIC VEHICLE (BEV)
7.4.2 HYBRID ELECTRIC VEHICLE (HEV)
7.4.3 PLUG-IN HYBRID ELECTRIC VEHICLE (PHEV)
8 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY VEHICLE TYPE
8.1 OVERVIEW
8.2 PASSENGER CAR
8.2.1 PROCESSOR
8.2.1.1. MICROPROCESSOR UNITS (MPUS)
8.2.1.2. MICROCONTROLLER UNITS (MCUS)
8.2.1.3. DIGITAL SIGNAL PROCESSORS (DSPS)
8.2.1.4. GRAPHIC PROCESSING UNITS (GPUS)
8.2.2 ANALOG IC
8.2.2.1. AMPLIFIERS
8.2.2.2. INTERFACES
8.2.2.3. CONVERTORS
8.2.2.4. COMPARATORS
8.2.2.5. ASICS AND ASSPS
8.2.2.6. LOGIC ICS
8.2.2.7. INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES
8.2.3 DISCRETE POWER DEVICES
8.2.3.1. SMALL SIGNAL TRANSISTORS
8.2.3.2. POWER TRANSISTORS
8.2.3.3. THYRISTORS
8.2.3.4. RECTIFIERS AND DIODES
8.2.4 SENSOR
8.2.4.1. IMAGE SENSORS
8.2.4.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS
8.2.4.1.2. CHARGE-COUPLED DEVICES (CCDS)
8.2.4.2. PRESSURE SENSORS
8.2.4.3. INERTIAL SENSORS
8.2.4.3.1. ACCELEROMETERS
8.2.4.3.2. GYROSCOPES
8.2.4.4. TEMPERATURE SENSORS
8.2.4.5. RADARS
8.2.5 MEMORY DEVICE
8.2.5.1. DYNAMIC RANDOM-ACCESS MEMORY (DRAM)
8.2.5.2. STATIC RANDOM-ACCESS MEMORY (SRAM)
8.2.6 LIGHTING DEVICE
8.3 LIGHT COMMERCIAL VEHICLE (LCV)
8.3.1 PROCESSOR
8.3.1.1. MICROPROCESSOR UNITS (MPUS)
8.3.1.2. MICROCONTROLLER UNITS (MCUS)
8.3.1.3. DIGITAL SIGNAL PROCESSORS (DSPS)
8.3.1.4. GRAPHIC PROCESSING UNITS (GPUS)
8.3.2 ANALOG IC
8.3.2.1. AMPLIFIERS
8.3.2.2. INTERFACES
8.3.2.3. CONVERTORS
8.3.2.4. COMPARATORS
8.3.2.5. ASICS AND ASSPS
8.3.2.6. LOGIC ICS
8.3.2.7. INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES
8.3.3 DISCRETE POWER DEVICES
8.3.3.1. SMALL SIGNAL TRANSISTORS
8.3.3.2. POWER TRANSISTORS
8.3.3.3. THYRISTORS
8.3.3.4. RECTIFIERS AND DIODES
8.3.4 SENSOR
8.3.4.1. IMAGE SENSORS
8.3.4.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS
8.3.4.1.2. CHARGE-COUPLED DEVICES (CCDS)
8.3.4.2. PRESSURE SENSORS
8.3.4.3. INERTIAL SENSORS
8.3.4.3.1. ACCELEROMETERS
8.3.4.3.2. GYROSCOPES
8.3.4.4. TEMPERATURE SENSORS
8.3.4.5. RADARS
8.3.5 MEMORY DEVICE
8.3.5.1. DYNAMIC RANDOM-ACCESS MEMORY (DRAM)
8.3.5.2. STATIC RANDOM-ACCESS MEMORY (SRAM)
8.3.6 LIGHTING DEVICE
8.4 HEAVY COMMERCIAL VEHICLE (HCV)
8.4.1 PROCESSOR
8.4.1.1. MICROPROCESSOR UNITS (MPUS)
8.4.1.2. MICROCONTROLLER UNITS (MCUS)
8.4.1.3. DIGITAL SIGNAL PROCESSORS (DSPS)
8.4.1.4. GRAPHIC PROCESSING UNITS (GPUS)
8.4.2 ANALOG IC
8.4.2.1. AMPLIFIERS
8.4.2.2. INTERFACES
8.4.2.3. CONVERTORS
8.4.2.4. COMPARATORS
8.4.2.5. ASICS AND ASSPS
8.4.2.6. LOGIC ICS
8.4.2.7. INFOTAINMENTS, TELEMATICS, AND CONNECTIVITY DEVICES
8.4.3 DISCRETE POWER DEVICES
8.4.3.1. SMALL SIGNAL TRANSISTORS
8.4.3.2. POWER TRANSISTORS
8.4.3.3. THYRISTORS
8.4.3.4. RECTIFIERS AND DIODES
8.4.4 SENSOR
8.4.4.1. IMAGE SENSORS
8.4.4.1.1. COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSORS
8.4.4.1.2. CHARGE-COUPLED DEVICES (CCDS)
8.4.4.2. PRESSURE SENSORS
8.4.4.3. INERTIAL SENSORS
8.4.4.3.1. ACCELEROMETERS
8.4.4.3.2. GYROSCOPES
8.4.4.4. TEMPERATURE SENSORS
8.4.4.5. RADARS
8.4.5 MEMORY DEVICE
8.4.5.1. DYNAMIC RANDOM-ACCESS MEMORY (DRAM)
8.4.5.2. STATIC RANDOM-ACCESS MEMORY (SRAM)
8.4.6 LIGHTING DEVICE
9 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY APPLICATION
9.1 OVERVIEW
9.2 POWERTRAIN
9.2.1 STARTER/ALTERNATOR
9.2.2 TRANSMISSION CONTROL UNIT
9.2.3 ENGINE CONTROL UNIT
9.3 SAFETY
9.3.1 AIR BAG
9.3.2 ADAPTIVE CRUISE CONTROL
9.3.3 PARKING ASSISTANCE
9.3.4 NIGHT VISION
9.3.5 ELECTRONIC SAFETY CONTROL
9.3.6 OTHERS
9.4 TELEMATICS AND INFOTAINMENT
9.4.1 NAVIGATION UNIT
9.4.2 AUDIO UNIT
9.4.3 DISPLAY UNIT
9.4.4 WIDE & SHORT RANGE COMMUNICATION
9.4.5 DASHBOARDS
9.4.6 INSTRUMENT CLUSTER
9.4.6.1. ANALOG
9.4.6.2. DIGITAL
9.4.6.3. HYBRID
9.5 BODY ELECTRONICS
9.5.1 BODY CONTROL MODULES
9.5.2 MIRROR AND WINDOW CONTROL
9.5.3 HVAC SYSTEM
9.5.4 LOGHT, LIGHTING CONTROL
9.5.5 POWER OPERATED SYSTEM (SEAT & DOOR)
9.5.6 OTHERS
9.6 CHASSIS
9.6.1 SUSPENSION
9.6.2 STEERING
9.6.3 VEHICLE DYNAMIC MANAGEMENT
9.6.4 TRACTION CONTROL
9.6.5 BRAKES
10 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY SALES CHANNEL
10.1 OVERVIEW
10.2 DIRECT SALES
10.3 INDIRECT SALES
11 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, BY GEOGRAPHY
GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, (ALL SEGMENTATION PROVIDED ABOVE IS REPRESENTED IN THIS CHAPTER BY COUNTRY)
11.1 NORTH AMERICA
11.1.1 U.S.
11.1.2 CANADA
11.1.3 MEXICO
11.2 EUROPE
11.2.1 GERMANY
11.2.2 FRANCE
11.2.3 U.K.
11.2.4 ITALY
11.2.5 SPAIN
11.2.6 RUSSIA
11.2.7 TURKEY
11.2.8 BELGIUM
11.2.9 NETHERLANDS
11.2.10 SWITZERLAND
11.2.11 SWEDEN
11.2.12 DENMARK
11.2.13 POLAND
11.2.14 REST OF EUROPE
11.3 ASIA PACIFIC
11.3.1 JAPAN
11.3.2 CHINA
11.3.3 SOUTH KOREA
11.3.4 INDIA
11.3.5 AUSTRALIA AND NEW ZEALAND
11.3.6 SINGAPORE
11.3.7 THAILAND
11.3.8 MALAYSIA
11.3.9 INDONESIA
11.3.10 PHILIPPINES
11.3.11 TAIWAN
11.3.12 VIETNAM
11.3.13 REST OF ASIA PACIFIC
11.4 SOUTH AMERICA
11.4.1 BRAZIL
11.4.2 ARGENTINA
11.4.3 REST OF SOUTH AMERICA
11.5 MIDDLE EAST AND AFRICA
11.5.1 SOUTH AFRICA
11.5.2 EGYPT
11.5.3 SAUDI ARABIA
11.5.4 U.A.E
11.5.5 ISRAEL
11.5.6 KUWAIT
11.5.7 QATAR
11.5.8 REST OF MIDDLE EAST AND AFRICA
11.6 KEY PRIMARY INSIGHTS: BY MAJOR COUNTRIES
12 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET,COMPANY LANDSCAPE
12.1 COMPANY SHARE ANALYSIS: GLOBAL
12.2 COMPANY SHARE ANALYSIS: NORTH AMERICA
12.3 COMPANY SHARE ANALYSIS: EUROPE
12.4 COMPANY SHARE ANALYSIS: ASIA PACIFIC
12.5 MERGERS & ACQUISITIONS
12.6 NEW PRODUCT DEVELOPMENT AND APPROVALS
12.7 EXPANSIONS
12.8 REGULATORY CHANGES
12.9 PARTNERSHIP AND OTHER STRATEGIC DEVELOPMENTS
13 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET , SWOT & DBMR ANALYSIS
14 GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, COMPANY PROFILE
14.1 NXP SEMICONDUCTORS N.V.
14.1.1 COMPANY SNAPSHOT
14.1.2 REVENUE ANALYSIS
14.1.3 PRODUCT PORTFOLIO
14.1.4 RECENT DEVELOPMENTS
14.2 RENESAS ELECTRONICS CORP.
14.2.1 COMPANY SNAPSHOT
14.2.2 REVENUE ANALYSIS
14.2.3 PRODUCT PORTFOLIO
14.2.4 RECENT DEVELOPMENTS
14.3 INFINEON TECHNOLOGIES AG
14.3.1 COMPANY SNAPSHOT
14.3.2 REVENUE ANALYSIS
14.3.3 PRODUCT PORTFOLIO
14.3.4 RECENT DEVELOPMENTS
14.4 STMICROELECTRONICS N.V.
14.4.1 COMPANY SNAPSHOT
14.4.2 REVENUE ANALYSIS
14.4.3 PRODUCT PORTFOLIO
14.4.4 RECENT DEVELOPMENTS
14.5 ROBERT BOSCH GMBH
14.5.1 COMPANY SNAPSHOT
14.5.2 REVENUE ANALYSIS
14.5.3 PRODUCT PORTFOLIO
14.5.4 RECENT DEVELOPMENTS
14.6 TEXAS INSTRUMENTS INC.
14.6.1 COMPANY SNAPSHOT
14.6.2 REVENUE ANALYSIS
14.6.3 PRODUCT PORTFOLIO
14.6.4 RECENT DEVELOPMENTS
14.7 SEMICONDUCTOR CORP.
14.7.1 COMPANY SNAPSHOT
14.7.2 REVENUE ANALYSIS
14.7.3 PRODUCT PORTFOLIO
14.7.4 RECENT DEVELOPMENTS
14.8 ON SEMICONDUCTORS CORP.
14.8.1 COMPANY SNAPSHOT
14.8.2 REVENUE ANALYSIS
14.8.3 PRODUCT PORTFOLIO
14.8.4 RECENT DEVELOPMENTS
14.9 ROHM CO. LTD.
14.9.1 COMPANY SNAPSHOT
14.9.2 REVENUE ANALYSIS
14.9.3 PRODUCT PORTFOLIO
14.9.4 RECENT DEVELOPMENTS
14.1 TOSHIBA CORPORATION
14.10.1 COMPANY SNAPSHOT
14.10.2 REVENUE ANALYSIS
14.10.3 PRODUCT PORTFOLIO
14.10.4 RECENT DEVELOPMENTS
14.11 ANALOG DEVICES INC.
14.11.1 COMPANY SNAPSHOT
14.11.2 REVENUE ANALYSIS
14.11.3 PRODUCT PORTFOLIO
14.11.4 RECENT DEVELOPMENTS
14.12 MITSUBISHI ELECTRIC SOLUTIONS
14.12.1 COMPANY SNAPSHOT
14.12.2 REVENUE ANALYSIS
14.12.3 PRODUCT PORTFOLIO
14.12.4 RECENT DEVELOPMENTS
14.13 SAMSUNG
14.13.1 COMPANY SNAPSHOT
14.13.2 REVENUE ANALYSIS
14.13.3 PRODUCT PORTFOLIO
14.13.4 RECENT DEVELOPMENTS
14.14 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
14.14.1 COMPANY SNAPSHOT
14.14.2 REVENUE ANALYSIS
14.14.3 PRODUCT PORTFOLIO
14.14.4 RECENT DEVELOPMENTS
14.15 INTEL CORPORATION
14.15.1 COMPANY SNAPSHOT
14.15.2 REVENUE ANALYSIS
14.15.3 PRODUCT PORTFOLIO
14.15.4 RECENT DEVELOPMENTS
14.16 BROADCOM INC.
14.16.1 COMPANY SNAPSHOT
14.16.2 REVENUE ANALYSIS
14.16.3 PRODUCT PORTFOLIO
14.16.4 RECENT DEVELOPMENTS
14.17 ASE
14.17.1 COMPANY SNAPSHOT
14.17.2 REVENUE ANALYSIS
14.17.3 PRODUCT PORTFOLIO
14.17.4 RECENT DEVELOPMENTS
14.18 NANJING SEMIDRIVE TECHNOLOGY LTD.
14.18.1 COMPANY SNAPSHOT
14.18.2 REVENUE ANALYSIS
14.18.3 PRODUCT PORTFOLIO
14.18.4 RECENT DEVELOPMENTS
14.19 CALTERAH SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO., LTD.
14.19.1 COMPANY SNAPSHOT
14.19.2 REVENUE ANALYSIS
14.19.3 PRODUCT PORTFOLIO
14.19.4 RECENT DEVELOPMENTS
14.2 LATTICE SEMICONDUCTOR
14.20.1 COMPANY SNAPSHOT
14.20.2 REVENUE ANALYSIS
14.20.3 PRODUCT PORTFOLIO
14.20.4 RECENT DEVELOPMENTS
14.21 SK HYNIX INC.
14.21.1 COMPANY SNAPSHOT
14.21.2 REVENUE ANALYSIS
14.21.3 PRODUCT PORTFOLIO
14.21.4 RECENT DEVELOPMENTS
14.22 QUALCOMM TECHNOLOGIES
14.22.1 COMPANY SNAPSHOT
14.22.2 REVENUE ANALYSIS
14.22.3 PRODUCT PORTFOLIO
14.22.4 RECENT DEVELOPMENTS
14.23 MICRON TECHNOLOGY INC.
14.23.1 COMPANY SNAPSHOT
14.23.2 REVENUE ANALYSIS
14.23.3 PRODUCT PORTFOLIO
14.23.4 RECENT DEVELOPMENTS
14.24 MICROCHIP TECHNOLOGY INCORPORATED
14.24.1 COMPANY SNAPSHOT
14.24.2 REVENUE ANALYSIS
14.24.3 PRODUCT PORTFOLIO
14.24.4 RECENT DEVELOPMENTS
14.25 NVIDIA CORPORATION
14.25.1 COMPANY SNAPSHOT
14.25.2 REVENUE ANALYSIS
14.25.3 PRODUCT PORTFOLIO
14.25.4 RECENT DEVELOPMENTS
*NOTE: THE COMPANIES PROFILED IS NOT EXHAUSTIVE LIST AND IS AS PER OUR PREVIOUS CLIENT REQUIREMENT. WE PROFILE MORE THAN 100 COMPANIES IN OUR STUDY AND HENCE THE LIST OF COMPANIES CAN BE MODIFIED OR REPLACED ON REQUEST
15 RELATED REPORTS
16 QUESTIONNAIRE
17 ABOUT DATA BRIDGE MARKET RESEARCH