Global Semiconductor Packaging Materials Market, By Packaging Material (Organic Substrate, Bonding Wire, Lead frame, Ceramic Package, Die Attach Material, Others), Wafer Material (Simple Semiconductor, Compound Semiconductor), Technology (Grid Array, Small Outline Package, Flat No-Leads Packages, Dual In-Line Package, Others), End User (Consumer Electronics, Automotive, Healthcare, IT and Telecommunication, Aerospace and Defence, Others) – Industry Trends and Forecast to 2029
Semiconductor Packaging Materials Market Analysis and Size
Semiconductor packaging materials play a vital role in protecting IC chips from the environment, and confirming the electrical connection for chip mount on printed wiring boards. Now-a-days, the demand of the semiconductor packaging material increases due to its high usage in the packaging of goods such as smartwatches, mobile phones, tablets, communication devices and fitness bands. Furthermore, its usage in automotive devices has also augmented in recent days. The global semiconductor packaging materials market is mainly driven by the increasing demand for lead-free packaging solutions and the growing miniaturization of electronic devices. Moreover, several product innovations, such as the development in the production of new substrate designs which aid narrow bump pitches with higher density, are contributing to the growth of semiconductor packaging material market.
Data Bridge Market Research analyses that the semiconductor packaging materials market is expected to undergo a CAGR of 3.20% during the forecast period. This indicates that the market value, which was USD 5,263.20 million in 2021, would rocket up to USD 6,771.54 million by 2029. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.
Semiconductor Packaging Materials Market Scope and Segmentation
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Report Metric
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Details
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Forecast Period
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2022 to 2029
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Base Year
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2021
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Historic Years
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2020 (Customizable to 2014 - 2019)
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Quantitative Units
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Revenue in USD Million, Volumes in Units, Pricing in USD
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Segments Covered
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Packaging Material (Organic Substrate, Bonding Wire, Lead frame, Ceramic Package, Die Attach Material, Others), Wafer Material (Simple Semiconductor, Compound Semiconductor), Technology (Grid Array, Small Outline Package, Flat No-Leads Packages, Dual In-Line Package, Others), End User (Consumer Electronics, Automotive, Healthcare, IT and Telecommunication, Aerospace and Defence, Others)
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Countries Covered
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U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia and New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, United Arab Emirate, Saudi Arabia, Egypt, Israel, South Africa, Rest of Middle East and Africa
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Market Players Covered
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Teledyne Technolgies (U.S.), SCHOTT (Germany), Amkor Technology (U.S.), KYOCERA Corporation (Japan), Materion Corporation (US), Egide (France), SGA Technologies (U.K.), Complete Hermetics (US), Special Hermetic Products Inc. (U.S.), Coat-X SA (Switzerland), Hermetics Solutions Group (U.S.), StratEdge (U.S.), Mackin Technologies (U.S.), Palomar Technologies (U.S.), CeramTec Gmbh (Germany), Electronic Products Inc. (U.S.), NGK Insulators Ltd. (Japan), Remtec Inc. (Canada)
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Market Opportunities
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Market Definition
Semiconductor packaging materials are used to prevent corrosion and damage in the integrated circuits (ICs). Some commonly available materials are bonding wires, solder balls, substrates, lead frames, encapsulants and underfill materials. Semiconductor materials occupy minimal space, shockproof and consume less power. As a result, they are extensively used across semiconductor industries.
Semiconductor Packaging Materials Market Dynamics
Drivers
- Increasing demand of organic substrate for semiconductor packaging
The demand of the organic substrate increases for the packaging of semiconductor. These materials are used on the foundation layer of the printed circuit boards (PCBs) for outstanding electrical performance and high reliability. The organic substrate packaging materials decrease the overall weight of PCBs and increase their dimensional control and functionality. The growing demand for organic substrate material for semiconductor packaging is expected to drive the growth rate of the semiconductor packaging materials market.
- Growing digitalization.
The growing digitization increases the demand for Internet of Things (IOT) in the market, driving the need for effective packaging globally and semiconductor packaging materials. The global semiconductor packaging materials market needs for semiconductor packaging which are increased by the growing adoption of smart computing devices such as laptops mobile phones e-readers, smart computing, tablets and smartphones in several developed and developing economies which are anticipated to increase the growth of the semiconductor packaging materials market.
- Rising demand of sustainable packaging
Many e-commerce industries are aiming to use the sustainable packaging solutions for the packaging of semiconductor devices to decrease the use of the plastic wastes and moving towards the use of sustainable packaging for the packaging of semiconductor products. This trend is also projected to hit the semiconductor packaging materials market, which is sensitive to exterior impacts with better designing to make packaging more stronger.
Opportunities
- Technological advancement
Technology development is embedded into packages, making a convincing business case for semiconductor packaging materials with the potential to increase profits and reduce costs. Technological advancement in the semiconductor packaging materials market are forcing to increase the growth of the semiconductor packaging material market because the semiconductor packaging design is evolving at a speedy rate. As technology increases, the demands of the semiconductor packaging material also goes up and changes accordingly, creating beneficial opportunities for the revenue growth of the market.
Furthermore, innovation of the technology in the mobile industries is also the main reason for the growth of the semiconductor packaging material market. Moreover, the innovation in medical devices such as mobile X-ray products, ultrasound devices and patient monitors and the improvement in the thermal performance of the aircraft components are also important opportunities that create the market growth.
Restraints/Challenges
- High cost associated with raw materials of semiconductor packaging
Fluctuation in the price of the raw materials due to the outbreak of covid-19 pandemic hinders the growth of the semiconductor packaging material Market. The spread of this pandemic has a great impact on the transport of the raw materials which brought the interruption in the growth of the semiconductor packaging material market.
This semiconductor packaging materials market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the semiconductor packaging materials market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays
Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.
Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.
COVID-19 Impact on Semiconductor Packaging Materials Market
The outbreak of the COVID-19 has affected many industries and businesses. Even the impact of this pandemic has affected the size of the semiconductor packaging material market, this is due to the drastic changes in the automotive and electronic industries. Many electronic manufacturing hubs are temporarily close down their operations. The lack of transportation and the shortage of labors during this pandemic has interrupted the delivery of the products. Moreover, the shortage of raw materials also affected the growth of the semiconductor packaging material market
Expected Impact of Economic Slowdown on the Pricing and Availability of Products
When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.
Recent Development
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Global Semiconductor Packaging Materials Market Scope
The semiconductor packaging materials market is segmented on the basis of packaging material, wafer material, technology and end user. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.
Packaging Material
- Organic Substrate
- Bonding Wire
- Lead frame
- Ceramic Package
- Die Attach Material
- Others
Wafer Material
- Simple Semiconductor
- Compound Semiconductor
Technology
- Grid Array
- Small Outline Package
- Flat No-Leads Packages
- Dual In-Line Package
- Others
End User
- Consumer Electronics
- Automotive
- Healthcare
- IT and Telecommunication
- Aerospace and Defence
- Others
Semiconductor Packaging Materials Market Regional Analysis/Insights
The semiconductor packaging materials market is analysed and market size insights and trends are provided by country, packaging material, wafer material, technology and end user as referenced above.
The countries covered in the semiconductor packaging materials market report are U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, France, Italy, U.K., Belgium, Spain, Russia, Turkey, Netherlands, Switzerland, Rest of Europe, Japan, China, India, South Korea, Australia and New Zealand, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, United Arab Emirate, Saudi Arabia, Egypt, Israel, South Africa, Rest of Middle East and Africa.
North America dominates the semiconductor packaging materials market due to the high investments in the semiconductor sector and upsurge in demand for semiconductor packaging market within the region
Asia-Pacific will continue to project the highest compound annual growth rate during forecast period of 2022-2029 due to the rapid industrialization in this region.
The country section of the report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Semiconductor Packaging Materials Market Share Analysis
The semiconductor packaging materials market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to semiconductor packaging materials market.
Some of the major players operating in the semiconductor packaging materials market are:
- Teledyne Technologies (U.S.)
- SCHOTT (Germany)
- Amkor Technology (U.S.)
- KYOCERA Corporation (Japan)
- Materion Corporation (U.S.)
- Egide (France)
- SGA Technologies (U.K.)
- Complete Hermetics (U.S.)
- Special Hermetic Products Inc. (U.S.)
- Coat-X SA (Switzerland)
- Hermetics Solutions Group (U.S.)
- StratEdge (U.S.)
- Mackin Technologies (U.S.)
- Palomar Technologies (U.S.)
- CeramTec Gmbh (Germany)
- Electronic Products Inc. (U.S.)
- NGK Insulators Ltd. (Japan)
- Remtec Inc. (Canada)
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