Global Chip Scale Electronics Packaging Market, By Material (Plastic, Metal, Glass, Others), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others) – Industry Trends and Forecast to 2029.
Chip Scale Electronics Packaging Market Analysis and Size
Semiconductor packaging technology adds value to semiconductor products by preserving overall performance while lowering package costs. The use of semiconductor packaging for high-performance chips used in virtual products is growing. Personal and laptop computers have become necessities for today's technology-driven young consumers. Furthermore, the advancement and innovation in the electronics industry are expected to drive semiconductor packaging sales over the next decade.
Data Bridge Market Research analyses that the chip scale electronics packaging market which was growing at a value of 28.49 billion in 2021 and is expected to reach the value of USD 102.81 billion by 2029, at a CAGR of 17.40% during the forecast period of 2022-2029. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.
Chip Scale Electronics Packaging Market Scope and Segmentation
|
Report Metric
|
Details
|
|
Forecast Period
|
2022 to 2029
|
|
Base Year
|
2021
|
|
Historic Years
|
2020 (Customizable to 2014 - 2019)
|
|
Quantitative Units
|
Revenue in USD billion, Volumes in Units, Pricing in USD
|
|
Segments Covered
|
Material (Plastic, Metal, Glass, Others), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, Others)
|
|
Countries Covered
|
U.S., Canada, Mexico, Brazil, Argentina, Rest of South America, Germany, Italy, U.K., France, Spain, Netherlands, Belgium, Switzerland, Turkey, Russia, Rest of Europe, Japan, China, India, South Korea, Australia, Singapore, Malaysia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific, Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa
|
|
Market Players Covered
|
ASE Technology Holding Co., Ltd. (China), Amkor Technology (U.S.), JCET Global (China), Siliconware Precision Industries Co., Ltd. (China), Powertech Technology Inc. (China), TongFu Microelectronics Co.,Ltd. (China), Lingsen Precision Industries , LTD. (China), Sigurd Corporation (China), OSE CORP. (China), Tianshui Huatian Technology Co.,Ltd (China), UTAC. (Singapore), King Yuan ELECTRONICS CO., LTD. (China), ChipMOS TECHNOLOGIES INC. (China), Formosa Advanced Technologies Co., Ltd. (Taiwan)
|
|
Opportunities
|
|
Market Definition
The design and manufacturing of electronic equipments ranging from single semiconductors to entire systems such as mainframe computers are called electronic packaging. This protects against mechanical damage, cooling, radio frequency noise emission, and electrostatic discharge. Efficient electrical and semiconductor packaging is used throughout the manufacturing of consumer electronic goods to protect against electrostatic discharge, water, harsh weather conditions, corrosion, and dust. As it allows for reduced board area, weight, and PCB routing complexity, it is used in various army and aerospace facilities that contain semiconductor devices.
Global Chip Scale Electronics Packaging Market Dynamics
Drivers
- High adoption of consumer electronic devices
One of the key factors driving market growth is the widespread use of products in the consumer electronics industry. Semiconductors are widely used in devices that are lightweight, small, and portable, such as smartphones, tablets, smartwatches, fitness bands, and communication devices. Furthermore, significant growth in the automotive industry is boosting market growth. Semiconductor integrated circuits (ICs) are widely used in many products, including anti-lock braking systems (ABS), infotainment, airbag control, collision detection technology, and windows.
- Rapid utilisation of technological integrated industrial devices
The growing use of AI and Internet of Things (IoT)-integrated industrial devices with high power requirements is also increasing demand for chip scale electronics packaging. In line with this, rising environmental consciousness among the general public and the growing need to reduce electronic waste are positively impacting market growth. Other factors expected to drive market growth include widespread product adoption in the aerospace industry to improve the thermal performance of aircraft components and rising demand for semiconductor packaging in medical devices such as ultrasound devices, mobile X-ray systems, and patient monitors.
Opportunities
- Device miniaturization
The surge in device miniaturization is assisting the chip scale electronics packaging market in regaining demand. Furthermore, heavy government investment in developing semiconductor manufacturing plants, particularly in developing countries, is expected to fuel market growth.
Restraints
- High cost
However, concerns about heat dissipation and the initial high cost of electronic packaging will act as restraints and may impede the growth of the chip scale electronics packaging market during the forecasted period.
This chip scale electronics packaging market report provides details of new recent developments, trade regulations, import-export analysis, production analysis, value chain optimization, market share, impact of domestic and localized market players, analyses opportunities in terms of emerging revenue pockets, changes in market regulations, strategic market growth analysis, market size, category market growths, application niches and dominance, product approvals, product launches, geographic expansions, technological innovations in the market. To gain more info on the chip scale electronics packaging market contact Data Bridge Market Research for an Analyst Brief, our team will help you take an informed market decision to achieve market growth.
Impact and Current Market Scenario of Raw Material Shortage and Shipping Delays
Data Bridge Market Research offers a high-level analysis of the market and delivers information by keeping in account the impact and current market environment of raw material shortage and shipping delays. This translates into assessing strategic possibilities, creating effective action plans, and assisting businesses in making important decisions.
Apart from the standard report, we also offer in-depth analysis of the procurement level from forecasted shipping delays, distributor mapping by region, commodity analysis, production analysis, price mapping trends, sourcing, category performance analysis, supply chain risk management solutions, advanced benchmarking, and other services for procurement and strategic support.
COVID-19 Impact on Chip Scale Electronics Packaging Market
The COVID-19 epidemic has reduced demand for electronic packaging. Gadget production has ceased as a result of the lockdown. As a result, the entire supply chain of the global chip scale electronics packaging has been disrupted. In contrast, the chip scale electronics packaging sees an opportunity in the current crisis as companies begin to work from home and end-users consume more information on digital platforms, increasing the demand for storage and memory solutions for data centres, laptops, and other devices. The use of medical devices with integrated electronic packaging for bio-imaging and clinical diagnostics is currently driving the chip scale electronics packaging industry. Companies that manufacture ICs and semiconductor devices are expected to update production planning, sourcing strategy, and change industry dynamics to drive growth, thereby increasing the chip scale electronics packaging size and chip scale electronics packaging market share.
Expected Impact of Economic Slowdown on the Pricing and Availability of Products
When economic activity slows, industries begin to suffer. The forecasted effects of the economic downturn on the pricing and accessibility of the products are taken into account in the market insight reports and intelligence services provided by DBMR. With this, our clients can typically keep one step ahead of their competitors, project their sales and revenue, and estimate their profit and loss expenditures.
Recent Development
- In June 2022 Advanced Semiconductor Engineering, Inc. (ASE) will introduce VI PackTM, an advanced packaging platform designed to enable vertically integrated package solutions. VI PackTM is the next generation of ASE's 3D heterogeneous integration architecture, which extends design rules while achieving ultra-high density and performance.
- In June 2022 Tera View will release the EOTPR 4500, a purpose-built integrated circuit package inspection machine. The EOTPR 4500 auto prober technology was developed to meet the demands of modern IC packaging technology, accepting substrate sizes up to 150mmx150mm while maintaining probe tip placement precision of +/- 0.5m.
Global Chip Scale Electronics Packaging Market Scope
The chip scale electronics packaging market is segmented on the basis of material and end user. The growth amongst these segments will help you analyse meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.
Material
- Plastic
- Metal
- Glass
- Others
End use
- Consumer Electronics
- Aerospace & Defense
- Automotive
- Telecommunication
- Others
Chip Scale Electronics Packaging Market Regional Analysis/Insights
The chip scale electronics packaging market is analysed and market size insights and trends are provided by country, material and end user as referenced above.
The countries covered in the chip scale electronics packaging market report are U.S., Canada and Mexico in North America, Germany, France, U.K., Netherlands, Switzerland, Belgium, Russia, Italy, Spain, Turkey, Rest of Europe in Europe, China, Japan, India, South Korea, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), Brazil, Argentina and Rest of South America as part of South America.
Asia-Pacific dominates the advanced packaging market during the forecast period. It is due to the presence of major market players in this region, as well as the rapid growth in demand for semiconductors across various industry verticals such as automotive, consumer electronics, aerospace, defence, and many others, as well as the government's heavy investment in building semiconductor manufacturing plants, particularly in developing countries.
North America is expected to grow at the highest rate over the forecast period, owing to the development of several advanced packaging technologies such as copper hybrid bonding and wafer level packaging (WPL) and the increasing demand for IoT-connected devices such as wearables.
The country section of the report also provides individual market impacting factors and changes in market regulation that impact the current and future trends of the market. Data points like down-stream and upstream value chain analysis, technical trends and porter's five forces analysis, case studies are some of the pointers used to forecast the market scenario for individual countries. Also, the presence and availability of Global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Chip Scale Electronics Packaging Market Share Analysis
The chip scale electronics packaging market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, Global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies' focus related to chip scale electronics packaging market.
Some of the major players operating in the chip scale electronics packaging market are:
- ASE Technology Holding Co., Ltd. (China)
- Amkor Technology (US)
- JCET Global (China)
- Siliconware Precision Industries Co., Ltd. (China)
- Powertech Technology Inc. (China)
- TongFu Microelectronics Co.,Ltd. (China)
- Lingsen Precision Industries , LTD. (China)
- Sigurd Corporation (China)
- OSE CORP. (China)
- Tianshui Huatian Technology Co.,Ltd (China)
- UTAC. (Singapore)
- King Yuan ELECTRONICS CO., LTD. (China)
- ChipMOS TECHNOLOGIES INC. (China)
- Formosa Advanced Technologies Co., Ltd. (Taiwan)
SKU-