Global Wafer Dicing Saws Market, By Packaging Technology (BGA, QFN, LTCC), Sales Channel (Direct Sales, Distributor), End-User (Pureplay foundries, IDMs) - Industry Trends and Forecast to 2030.
Wafer Dicing Saws Market Analysis and Size
The wafer dicing saws are basically the cutting machines that which help in separating individual silicon chips (die) from each other on the wafer. The dicing process is accomplished by mechanically sawing the wafer in the extra areas between the die.
The rising demand for internet of things (IoT) and number of semiconductor devices required for data centers and increasing in the number of fabs will emerge as the major factor driving market growth. Furthermore, the increasing self-driving cars coupled with growing demand from the emerging economies and development of laser wafer dicing saws will further aggravate the market value. The increase in the number of mobile devices, smart devices, and smart cards are also estimated to cushion the growth of the market. However, the high cost of production act as a restraint for the market.
Data Bridge Market Research analyzes that the global wafer dicing saws market which was valued at USD 97.30 million in 2022 and is expected to reach USD 141.51 million in 2030, registering a CAGR of 6.85% during the forecast period of 2023-2030. “BGA” (Ball Grid Array) segment dominates, driven by the widespread use of BGA packaging in semiconductor manufacturing for its compact design and enhanced thermal performance. In addition to the insights on market scenarios such as market value, growth rate, segmentation, geographical coverage, and major players, the market reports curated by the Data Bridge Market Research also include in-depth expert analysis, geographically represented company-wise production and capacity, network layouts of distributors and partners, detailed and updated price trend analysis and deficit analysis of supply chain and demand.
Report Scope and Market Segmentation
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Report Metric
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Details
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Forecast Period
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2023 to 2030
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Base Year
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2022
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Historic Years
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2021 (Customizable to 2015-2020)
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Quantitative Units
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Revenue in USD Million, Volumes in Units, Pricing in USD
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Segments Covered
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Packaging Technology (BGA, QFN, LTCC), Sales Channel (Direct Sales, Distributor), End-User (Pureplay foundries, IDMs)
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Countries Covered
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U.S., Canada, Mexico, U.K., Germany, France, Spain, Italy, Netherlands, Switzerland, Russia, Belgium, Turkey, Rest of Europe, China, South Korea, Japan, India, Australia, Singapore, Malaysia, Indonesia, Thailand, Philippines, Rest of Asia-Pacific, South Africa, Saudi Arabia, U.A.E., Israel, Egypt and Rest of Middle East and Africa, Brazil, Argentina, Rest of South America
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Market Players Covered
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GTI Technologies, Inc. (U.S.), Dynatex International (U.S.), ADT-Advanced Dicing Technologies (U.S.), Disco Corporation (Japan), Micross (U.S.), TOKYO SEIMITSU CO., LTD. (Japan), Loadpoint (U.K.), Komatsu NTC (Japan), Zhengzhou CY Scientific Instrument Co., Ltd. (China), Indotech Industries (I) Pvt. Ltd. (India), Multicut Machine Tools (India), ITL Industries Limited (India), Cosen Saws (U.S.), TecSaw International Limited (Canada), Marshall Machinery (U.S.), Vishwacon Engineers Private Limited (India), Mega Machine Co. Ltd. (Taiwan), Pro-Mech Engineering (U.S.), Prosaw Limited (U.K.), Perfect Laser (China)
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Market Opportunities
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Rising demand for advanced packaging
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Market Definition
Wafer dicing saws are precision machining tools used in the semiconductor and microelectronics industries to cut semiconductor wafers into individual integrated circuit chips or discrete electronic components. These saws employ a fine, high-speed blade or abrasive wire to perform precise, micro-scale cuts on the wafer's surface, enabling the separation of multiple microchips or electronic devices from a single wafer, a crucial step in the semiconductor manufacturing process. Wafer dicing saws are designed to achieve accurate and clean cuts with minimal damage to the chips, ensuring the reliability and functionality of the resulting electronic components.
Global Wafer Dicing Saws Market Dynamics
Drivers
- Semiconductor industry growth
The continuous expansion of the semiconductor industry is a primary driver for the wafer dicing saws market. As demand for smaller, more powerful electronic devices grows, so does the need for wafer dicing equipment. Dicing saws are crucial in separating silicon wafers into individual semiconductor chips, meeting the increasing demand for integrated circuits.
- Technological advancements
Ongoing technological advancements in wafer dicing saws have led to improved precision and efficiency. These saws now offer higher accuracy, lower kerf loss, and increased throughput. As a result, semiconductor manufacturers can achieve better yields and reduce production costs, making these technological advancements a significant driver for the market.
Opportunities
- Rising demand for advanced packaging
The growing demand for advanced packaging techniques, such as fan-out wafer-level packaging (FOWLP) and through-silicon via (TSV), presents a substantial opportunity for wafer dicing saws. These packaging methods require precise and efficient dicing solutions to handle delicate and intricate structures.
- Emerging applications
Beyond the semiconductor industry, wafer dicing saws are finding applications in various emerging technologies, including micro-electromechanical systems (MEMS), optoelectronics, and power devices. This diversification of applications broadens the market's scope and presents opportunities for growth.
Restraints/Challenges
- High initial investment
The cost of acquiring and maintaining advanced wafer dicing saws is a significant challenge. High initial investments, coupled with the need for specialized technical expertise, can be a barrier for smaller semiconductor manufacturers. This could limit market growth, particularly in developing regions.
- Environmental concerns
The dicing process generates waste materials, including slurry and dust particles, which may contain hazardous materials. Compliance with environmental regulations and the safe disposal of waste materials pose challenges for manufacturers. Ensuring sustainable and eco-friendly dicing processes is a priority in an environmentally conscious market.
- Market consolidation
The wafer dicing saws market is witnessing consolidation as major players acquire smaller companies and integrate their technologies. This consolidation can limit competition and potentially stifle innovation in the market, making it harder for new entrants to establish themselves.
Global Wafer Dicing Saws Market Scope
The wafer dicing saws market is segmented on the basis of packaging technology, sales channel and end-user. The growth amongst the different segments helps you in attaining the knowledge related to the different growth factors expected to be prevalent throughout the market and formulate different strategies to help identify core application areas and the difference in your target market.
Packaging Technology
- BGA
- QFN
- LTCC
Sales Channel
- Direct Sales
- Distributor
End-User
- Pureplay foundries
- IDMs
Global Wafer Dicing Saws Region Analysis/Insights
The wafer dicing saws market is analyzed and market size insights and trends are provided by country, packaging technology, sales channel and end-user as referenced above.
The countries covered in the wafer dicing saws market report are U.S., Canada, Mexico, U.K., Germany, France, Spain, Italy, Netherlands, Switzerland, Russia, Belgium, Turkey, rest of Europe, China, South Korea, Japan, India, Australia, Singapore, Malaysia, Indonesia, Thailand, Philippines, rest of Asia-Pacific, South Africa, Saudi Arabia, U.A.E., Israel, Egypt and rest of Middle East and Africa, Brazil, Argentina, rest of South America.
North America is expected to dominate the wafer dicing saws market due to increased amount of well-established in the region. Asia-Pacific region is expected to show significant growth during the forecast period due to the increase in the number of mobile devices, smart devices, and smart cards.
The country section of the wafer dicing saws market report also provides individual market impacting factors and changes in regulation in the market domestically that impacts the current and future trends of the market. Data points such as consumption volumes, production sites and volumes, import export analysis, price trend analysis, cost of raw materials, down-stream and upstream value chain analysis are some of the major pointers used to forecast the market scenario for individual countries. Also, presence and availability of global brands and their challenges faced due to large or scarce competition from local and domestic brands, impact of domestic tariffs and trade routes are considered while providing forecast analysis of the country data.
Competitive Landscape and Global Wafer Dicing Saws Market Share Analysis
The wafer dicing saws market competitive landscape provides details by competitor. Details included are company overview, company financials, revenue generated, market potential, investment in research and development, new market initiatives, global presence, production sites and facilities, production capacities, company strengths and weaknesses, product launch, product width and breadth, application dominance. The above data points provided are only related to the companies’ focus related to wafer dicing saws market.
Some of the major players operating in the wafer dicing saws market are
- GTI Technologies, Inc. (U.S.)
- Dynatex International (U.S.)
- ADT-Advanced Dicing Technologies (U.S.)
- Disco Corporation (Japan)
- Micross (U.S.)
- TOKYO SEIMITSU CO., LTD. (Japan)
- Loadpoint (U.K.)
- Komatsu NTC (Japan)
- Zhengzhou CY Scientific Instrument Co., Ltd. (China)
- Indotech Industries (I) Pvt. Ltd. (India)
- Multicut Machine Tools (India)
- ITL Industries Limited (India)
- Cosen Saws (U.S.)
- TecSaw International Limited (Canada)
- Marshall Machinery (U.S.)
- Vishwacon Engineers Private Limited (India)
- Mega Machine Co. Ltd. (Taiwan)
- Pro-Mech Engineering (U.S.)
- Prosaw Limited (U.K.)
- Perfect Laser (China)
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